Henkel Adhesive Technologies

Henkel Adhesive Technologies

Structural adhesives


High-performance epoxy adhesive for heat-sensitive components

A 1-part, epoxy bonder designed to cure at low temperatures that provides quick and powerful adhesion on delicate electronic components.

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LOCTITE® 3128 is a 1-part, heat-curable epoxy designed for use on small, heat sensitive components. Typical applications include things like memory cards and CCD/CMOS assemblies. It cures at low temperature and gives excellent adhesion on a wide range of materials in a considerably short amount of time. Performs particularly well when low-curing temperatures are required for heat-sensitive components.


Structural Bonding



Cure type:

Heat Cure

Key characteristics:

Viscosity: Medium Viscosity

Number of components:

1 Part

Storage temperature:

-15.0 °C - -25.0 °C

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