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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Structural adhesives


High-performance epoxy adhesive for heat-sensitive components

A 1-part epoxy bonder designed to cure at low temperatures. Provides quick and powerful adhesion on delicate electronic components.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

LOCTITE® 3128, 10 ml Syringe



LOCTITE® 3128 is a 1-part, heat-curable epoxy designed for use on small, heat-sensitive components. Typical applications include things like memory cards and CCD/CMOS assemblies. It cures at low temperature and gives excellent adhesion on a wide range of materials in a considerably short amount of time. Performs particularly well when low-curing temperatures are required for heat-sensitive components.

Product category:

Structural adhesives



Structural bonding



Cure type:

Heat cure

Key characteristics:

Viscosity: medium viscosity

Number of components:

1 part

Storage temperature:

-15.0 °C - -25.0 °C

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