Structural adhesives
High-performance epoxy adhesive for heat-sensitive components
A 1-part epoxy bonder designed to cure at low temperatures. Provides quick and powerful adhesion on delicate electronic components.
623566
LOCTITE® 3128, 10 ml Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® 3128 is a 1-part, heat-curable epoxy designed for use on small, heat-sensitive components. Typical applications include things like memory cards and CCD/CMOS assemblies. It cures at low temperature and gives excellent adhesion on a wide range of materials in a considerably short amount of time. Performs particularly well when low-curing temperatures are required for heat-sensitive components.
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Excellent adhesion on wide range of materials
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Fast acting
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Perfect for heat-sensitive components
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Heat-curable at low temperatures 80°C (176°F)
- Product category:
- Structural adhesives
Technologies:
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Thermosets, electronics assembly materials
- Applications:
- Structural bonding
- Color:
- Black
- Cure type:
- Heat cure
- Key characteristics:
- Viscosity: medium viscosity
- Number of components:
- 1 part
- Storage temperature:
- -15.0 °C - -25.0 °C
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
