Part no. (SKU/IDH):
2811435
IDH Name:
LOCTITE® ECCOBOND UF 9000AG, 30 cc Syringe
Underfills
Underfill encapsulant for flip-chip BGA and Cu pillars
A 1-part, epoxy-based, black, high-purity underfill encapsulant that is for flip-chip Ball Grid Array (BGA) and Cu pillar package applications.
Marketing materials
Part no. (SKU/IDH):
2811435
IDH Name:
LOCTITE® ECCOBOND UF 9000AG, 30 cc Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
LOCTITE® ECCOBOND UF 9000AG is a black, high purity semiconductor underfill encapsulant. It’s typically used for flip-chip BGA and Cu pillar package applications requiring low thermal expansion, fast capillary flow and long work life. It exhibits low resin bleed-out and low die warpage and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. It is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, protective seal that dissipates stress in solder joints and extends thermal cycling performance.
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Good flow with self-filleting
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High purity
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Low coefficient of thermal expansion (CTE)
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Low resin bleed-out
- Product category:
- Underfills
Technologies:
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Electronics semiconductor materials
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{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
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