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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Performance on display

From desktop to laptop to data center, every leap in performance begins with a packaging decision most people will never see. Explore the rooms of the exhibition, discover the beauty of those decisions, and see our range of innovative applications.

Golden connections

1998, polymer on silicon, dimensions variable

Every arc is deliberate, every wire placed with a precision measured in microns, repated billions of times a day without ever asking to be noticed.

Every bump a promise

2004, solder on substrate, dimensions variable

Every bump is a promise of conductivity. Together they form a geometry so dense it becomes its own kind of beauty.

Two hundred and twenty four

2012, encapsulant on silicon, undivided

Each square is identical. Each one will go its own way. This is the last moment they exist together.

No two the same

2019, chiplet on interposer, assembled

Sizes and functions vary, origins differ, but the surface they share is where real performance begins.

Next work: in development

2026, medium and dimensions to be confirmed

This frame stays empty until the right collaboration fills it. The first mark has been made. What comes next depends on the conversation we have not yet had.

Thanks for visiting

We hope our way of combining art and technology was a memorable experience. If you need expert advice on how you can use highly engineered materials to boost performance in your semiconductor packaging, we're ready to talk.

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Wirebond and advanced packaging curated 

No time to visit the gallery now? No problem. Read the article on wirebond and advanced packaging instead. Same journey. Your pace. 

Innovation is also an art form

At Henkel Adhesive Technologies, we work closely together with brands all over the world to ensure maximum performance at wafer level. Our expertise helps OSATs, IDMs, and system OEMs make the right architectural decisions before it is too late.  

That collaboration does not happen at a distance. Our inspiration centres in Düsseldorf and Shanghai bring customers and engineers together in the same lab, working side by side on the real challenges that define a programme's success.

This is an image of people in the inspiration center in düsseldorf
This is an image of a man with a tablet in his hand

What's most touched is least seen

Across the globe, smartphones and laptops might be the most-handled objects in modern life. The work that has elevated them from being tech gadgets to everyday infrastructure happens at scales no one outside a cleanroom ever sees. Before you read on, tell us which side of that work you live on. 

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