Case study
Learn how a top ICT innovator raised high-speed transceiver efficiency and reliability with a novel high thermal conductivity TIM.
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Next-gen 800G, 1.6T, and coherent optical module capabilities are vital to meeting the bandwidth and low-latency demands of surging AI workloads, but their larger, higher-powered chips run hot. This tech leader solved the challenge.
Managing the thermal load of next-generation 800G, 1.6T, and coherent optical transceivers demands a high-thermal-conductivity, low-impedance TIM that supports automated mass production, minimizes assembly stress, and protects sensitive optics from contamination or interference.
A 14.0 W/m·K, automation-friendly liquid gap filler with ultra-low volatility, long open time, excellent gap-variation tolerance, and proven high-temperature reliability enables consistent thermal control for larger, higher-power DSP-driven optical modules.
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High-speed optical transceivers are the gateway to reliable data delivery. -
Controlling transceiver heat is crucial, but not easy in a sensitive environment. -
How LOCTITE® TCF 14001 met the customer's challenging requirements.
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