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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Optical network unit

Fiber optic networks use OLT and ONU components at different points in the network to convert signals between electrical and fiber optic. Optoelectronic material must be formulated for maximized light transmittance, high bond strength, minimal shrinkage on cure, and high resistance to humidity.

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Phase Change Material with transparent background

Phase change materials

Bergquist Bond Ply thermally conductive adhesive tape used between power transistors and metal heatsink

BOND-PLY

TBD

LIQUI-BOND

Thermal Gels - Application of Thermal Gels

Thermal gels

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Thermal GAP PAD® materials

Black encapsulation material on component on white printed circuit board

Board level encapsulants

This graphic shows components bonded to a green PCB by electrically conductive adhesive.

Electrically conductive adhesives

Related industries

  • An image of a robotic arm holding a chip.

    Semiconductor

    Semiconductors and their novel packaging designs are digitizing our world. From automobiles to data centers, smartphones and 5G infrastructure, semiconductor packaging innovation is at the core of responsive, reliable, robust electronic functionality. That means semiconductors must deliver higher performance, smaller size, unfailing reliability and lower cost.
  • San Francisco city like an electric circuit board

    Data and telecommunications

    In data center, broadband connectivity, and optical networks, increasing speeds need more power, escalating performance-limiting heat and cost. Henkel’s cool, advanced material innovations help dissipate heat at the component level in high performance network applications.

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  • LOCTITE 263 Threadlocker - Application on Bolt

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