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Henkel Adhesive Technologies
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      Henkel Adhesive Technologies

      Enterprise Wi-Fi: indoor access point

      Fixed wireless access helps secure fast and seamless connectivity to boost 5G efficiency. The effectiveness of access points depends largely on the materials used to connect electronics, remove operational heat, and secure components.
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      Explore applications
      Thermal Gels - Application of Thermal Gels

      Thermal gels
      3D illustration of black PUR hotmelt being dispensed on edge of glass substance

      Thermal GAP PAD® materials
      Black encapsulation material on component on white printed circuit board

      Board level encapsulants
      This graphic shows components bonded to a green PCB by electrically conductive adhesive.

      Electrically conductive adhesives

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        Semiconductor
        Semiconductors and their novel packaging designs are digitizing our world. From automobiles to data centers, smartphones and 5G infrastructure, semiconductor packaging innovation is at the core of responsive, reliable, robust electronic functionality. That means semiconductors must deliver higher performance, smaller size, unfailing reliability and lower cost.
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        Data and telecommunications
        In data center, broadband connectivity, and optical networks, increasing speeds need more power, escalating performance-limiting heat and cost. Henkel’s cool, advanced material innovations help dissipate heat at the component level in high performance network applications.

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