Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal SIL PAD Materials

BERGQUIST SIL PAD TSP 1800

Electrically insulating, fibreglass reinforced - exceptional performance

Thermally conductive, fiberglass-reinforced, silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Documents

Information

BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. BERGQUIST SIL PAD TSP 1800 exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw and clip mounted applications.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Carrier type:

Fiberglass

Color:

Black

Flame rating:

V-0

Standard thickness:

0.229 mm - 0.406 mm

Thermal conductivity:

1.8 W/mK

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