Thermal SIL PAD Materials
Electrically insulating, fibreglass reinforced - exceptional performance
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
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Thermal impedance: 0.53°C-in2/W (@50 psi)
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Exceptional thermal performance at lower application pressures
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Superior breakdown voltage and surface wet-out values
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Smooth and non-tacky on both sides for easy re-positioning and assembly error reduction
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermal management, sil pads
- Carrier type:
- Fiberglass
- Color:
- Black
- Flame rating:
- V-0
- Standard thickness:
- 0.229 mm - 0.406 mm
- Thermal conductivity:
- 1.8 W/mK
