Part no. (SKU/IDH):
2190761
IDH Name:
BERGQUIST® HI FLOW THF 1600P
Phase change materials
High performance, electrically insulating, reinforced pad
This high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement is designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.
Marketing materials
Part no. (SKU/IDH):
2190761
IDH Name:
BERGQUIST® HI FLOW THF 1600P
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® HI FLOW THF 1600P is an electrically insulating, thermally conductive 55°C (131°F) phase reinforced change material with high temperature reliability (150°C / 302°F). Its polymide film provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The easy-release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.
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Thermal impedance: 0.13°C (32°F) in2/W @ 25 psi
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Outstanding thermal performance in an insulated pad
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Excellent cut-through resistance
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Excellent dielectric performance
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Phase change softening temp 55°C (131°F)
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Phase change materials
Technologies:
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Thermal management, speciality pads
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Thermal management, silicone-free pads
- Carrier type:
- Polyimide
- Color:
- Green
- Flame rating:
- V-0
- Operating temperature:
- 150.0 °C
- Standard thickness:
- 0.102 mm - 0.127 mm
- Thermal conductivity:
- 1.6 W/mK
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
