Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Soft, fibreglass reinforced insulation pad - low stress applications

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a thermal conductivity rating of 2.4 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.

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BERGQUIST® GAP PAD® TGP 2400 is a pre-cured silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.


Light Yellow


3.1 g/cm³

Dielectric breakdown voltage:

3000.0 Vac

Dielectric constant, @ 1kHz:


Flame rating:


Heat capacity, ASTM E1269:

1.0 J/g-K

Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:


Standard thickness:

0.254 mm - 6.35 mm

Thermal conductivity:

2.4 W/mK

Volume resistivity:

1×10 Ohm m

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