Part no. (SKU/IDH):
3059269
IDH Name:
BERGQUIST® GAP FILLER TGF 6500LVO, 400 cc Dual cartridge
Thermal gap fillers
Next‑generation thermal gap filler with highest‑in‑range 6.5 W/m·K conductivity
This 2‑part, silicone-based gap filler delivers highest‑in‑range thermal conductivity and is optimized for thin bondline thickness. It ensures reliable heat dissipation and stable performance in demanding electronic applications.
Part no. (SKU/IDH):
3059269
IDH Name:
BERGQUIST® GAP FILLER TGF 6500LVO, 400 cc Dual cartridge
Size Please make your selection 400 cc
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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Large volume or special order?
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- Description
- Technical specification
- Question & answer
BERQUIST® GAP FILLER TGF 6500LVO is a 2-part, silicone-based, thermally conductive gap filler designed for electronic thermal management applications. With thermal conductivity of 6.5 W/(m·K) and the ability to achieve thin bondline thickness, it enables efficient heat dissipation in compact designs. It offers excellent dispensing flow, low volatile outgassing, and reliable mechanical stability across automotive, industrial, and consumer electronics operating from -40°C to 150°C.
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Fast and robust dispensing supports automated, high‑throughput production lines
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Flexible cure at room temperature or accelerated heat cure
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Low volatile outgassing suitable for sensitive electronic applications
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Reliable performance across -40°C to 150°C operating range
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Globally available
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
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