Henkel Adhesive Technologies

Henkel Adhesive Technologies

Film adhesives

LOCTITE® ABLESTIK CF 3350

Film adhesive for electrical, thermal, and mechanical assembly applications 

This silver filled, flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks. 

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Documents

Information

If you need reliable RF ground plane performance, try LOCTITE® ABLESTIK CF 3350. This silver filled, flexible film adhesive has high electrical and thermal conductivity, as well as uniform bondline adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks. 

Cure schedule, @ 150.0 °C:

30.0 min.

Cure type:

Heat Cure

Physical form:

Film

Thermal conductivity:

7.0 W/mK

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