Part no. (SKU/IDH):
3083658
IDH Name:
LOCTITE® ABLESTIK CDF 900, Roll
Die attach adhesives
Conductive die attach film with controlled fillet and consistent bond line
This silver, conductive die attach film provides high thermal and electrical conductivity for attaching integrated circuits and components onto metal lead frames. It delivers controlled fillet size, no resin bleed out and consistent bond line thickness.
Part no. (SKU/IDH):
3083658
IDH Name:
LOCTITE® ABLESTIK CDF 900, Roll
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Question & answer
LOCTITE® ABLESTIK CDF 900 is a conductive die attach film designed to provide high thermal and electrical conductivity when attaching integrated circuits and components onto metal lead frames. It provides controlled fillet size, no resin bleed out and consistent bond line thickness, while supporting 8-inch and 12-inch wafers. The adhesive exhibits strong adhesion to various wafer metallization and lead frame finishes.
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High thermal and electrical conductivity
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No resin bleed out
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Consistent bond line thickness
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Controlled fillet size
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Compatible with pre-cut wafer lamination equipment
- Product category:
- Die attach films
How to use
Laminate the wafer backside at 70°C and 20 to 40 psi, using a taping rate of 1 to 4 ft/minute.
Perform chip attach at 90°C to 110°C.
Use 0.5 to 1 kg pressure during chip attach.
Maintain the chip attach for 0.5 to 1 second.
Ramp from 25°C to 175°C over 30 minutes, then hold at 175°C for 60 minutes in a 7 kg/cm² pressure oven.
FAQ
It is a conductive die attach film for attaching integrated circuits and components onto metal lead frames. Typical package applications are QFN, TQFP and eTQFP.
The product is specified for 8-inch and 12-inch wafers.
The stated adhesive thicknesses are 15 µm and 30 µm.
It can be used with die sizes ranging from 3 mm × 3 mm to 7 mm × 7 mm.
Store the product unopened in a dry location at an optimal temperature of 0°C to 5°C.
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