Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically non-conductive adhesives

LOCTITE® 3609

Medium to high dispense speed, non-conductive, surface mount adhesive  

This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Documents

Information

If you’re looking for a surface mount adhesive with medium to high dispense speeds, choose LOCTITE® 3609. This epoxy based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead free wave solder with both water-based and alcohol-based fluxes. 

Color:

Red

Cure type:

Heat Cure

Number of components:

1 Part

Physical form:

Gel

Shear strength, Steel (grit blasted):

1450.0 psi

Storage temperature:

2.0 °C - 8.0 °C

Viscosity, cone & plate Haake PK100, M10/PK1, 2°:

0.16 Pa∙s - 20.0 Pa∙s

Please contact us for ordering options

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