Potting compounds
Thermally conductive, 2-part epoxy encapsulant
Thermally conductive epoxy encapsulant for protecting components that require heat dissipation and thermal shock properties.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
For a low-CTE epoxy encapsulant that can be used with a variety of catalysts, we recommend LOCTITE® STYCAST 2850FT. This black, room temperature-curing epoxy resin is the optimal solution for encapsulating components requiring heat dissipation and thermal shock properties. It’s a 2-part product and thermally conductive, a great feature that helps with component cooling. LOCTITE® STYCAST 2850FT is also available in an unpigmented version and can be used with LOCTITE® catalysts (or hardeners) CAT 9, CAT 11, CAT 23LV, and CAT 24LV.
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Thermally conductive and electrically insulative
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Thermal shock-resistant
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Low coefficient of thermal expansion (CTE)
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Can be used with a variety of catalysts
- Product category:
- Potting compounds
Technologies:
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Thermosets, electronics assembly materials
- Applications:
- Encapsulating
- Color:
- Black
- Cure type:
- Room temperature (ambient) cure
- Number of components:
- 2 part
- Viscosity, Spindle 7, Speed 10 rpm:
- 250000.0 mPa·s (cP)
