Underfills
Underfill encapsulant for flip-chip BGA and Cu pillars
A 1-part, epoxy-based, black, high-purity underfill encapsulant that is for flip-chip Ball Grid Array (BGA) and Cu pillar package applications.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND UF 9000AG is a black, high purity semiconductor underfill encapsulant. It’s typically used for flip-chip BGA and Cu pillar package applications requiring low thermal expansion, fast capillary flow and long work life. It exhibits low resin bleed-out and low die warpage and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. It is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, protective seal that dissipates stress in solder joints and extends thermal cycling performance.
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Good flow with self-filleting
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High purity
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Low coefficient of thermal expansion (CTE)
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Low resin bleed-out
- Product category:
- Underfills
Technologies:
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Thermosets, electronics semiconductor materials
