Underfills
One-part underfill compatible with small gap sizes
One-part, epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1 mm.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
If you’re looking for an underfill to increase the reliability of small-gap flip-chips, consider LOCTITE® ECCOBOND FP4531. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications via capillary action. LOCTITE® ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.
-
Compatible with small gap sizes
-
Snap-curable
-
Fast flow
-
Passes NASA outgassing
- Product category:
- Underfills
Technologies:
-
Thermosets, electronics assembly materials
- Flexural modulus:
- 7600.0 N/mm² (1102000.0 psi)
