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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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One-part underfill compatible with small gap sizes

One-part, epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1 mm.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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If you’re looking for an underfill to increase the reliability of small-gap flip-chips, consider LOCTITE® ECCOBOND FP4531. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications via capillary action. LOCTITE® ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.

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Flexural modulus:

7600.0 N/mm² (1102000.0 psi)

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