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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermally conductive adhesives

LOCTITE® ABLESTIK 8700K

Non-slump, die-attach adhesive for Gold film surfaces 

This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping. 

  • Product category:
  • Thermally conductive adhesives

Technologies:

  • Applications:
  • Die attach

 

  • Coefficient of thermal expansion (CTE):
  • 20.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 55.0 ppm/°C

 

  • Color:
  • White

 

  • Cure schedule, @ 175.0 °C:
  • 1.0 hr.

 

  • Cure type:
  • Heat cure

 

  • Glass transition temperature (Tg):
  • 165.0 °C

 

  • RT die shear strength, 2 x 2 mm on Gold:
  • 5000.0 kg-f

 

  • Thermal conductivity:
  • 0.5 W/mK

 

  • Viscosity, @ 25.0 °C:
  • 45000.0 mPa·s (cP)

 

  • Volume resistivity:
  • 3x10¹⁴ Ohm cm

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

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