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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermally conductive adhesives


Non-slump, die-attach adhesive for Gold film surfaces 

This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping. 

Product category:

Thermally conductive adhesives



Die attach

Coefficient of thermal expansion (CTE):

20.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

55.0 ppm/°C



Cure schedule, @ 175.0 °C:

1.0 hr.

Cure type:

Heat cure

Glass transition temperature (Tg):

165.0 °C

RT die shear strength, 2 x 2 mm on Gold:

5000.0 kg-f

Thermal conductivity:

0.5 W/mK

Viscosity, @ 25.0 °C:

45000.0 mPa·s (cP)

Volume resistivity:

3x10¹⁴ Ohm cm

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