Thermally conductive adhesives
Non-slump, die-attach adhesive for Gold film surfaces
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
-
Non-conductive
-
Excellent adhesion
-
For thin & thick film gold surfaces
-
Heat cure
-
Non-slump
- Product category:
- Thermally conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 20.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 55.0 ppm/°C
- Color:
- White
- Cure schedule, @ 175.0 °C:
- 1.0 hr.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 165.0 °C
- RT die shear strength, 2 x 2 mm on Gold:
- 5000.0 kg-f
- Thermal conductivity:
- 0.5 W/mK
- Viscosity, @ 25.0 °C:
- 45000.0 mPa·s (cP)
- Volume resistivity:
- 3x10¹⁴ Ohm cm
