Thermally conductive adhesives
Non-slump, die-attach adhesive for Gold film surfaces
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
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Non-conductive
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Excellent adhesion
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For thin & thick film gold surfaces
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Heat cure
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Non-slump
Applications:
Die attach
Coefficient of thermal expansion (CTE):
20.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg:
55.0 ppm/°C
Color:
White
Cure schedule, @ 175.0 °C:
1.0 hr.
Cure type:
Heat cure
Glass transition temperature (Tg):
165.0 °C
RT die shear strength, 2 x 2 mm on Gold:
5000.0 kg-f
Thermal conductivity:
0.5 W/mK
Viscosity, @ 25.0 °C:
45000.0 mPa·s (cP)
Volume resistivity:
3x10¹⁴ Ohm cm