Encapsulants
Flexible encapsulant for Pb-free applications
This 1-part, thixotropic coating liquid provides components on PCBs a flexible, low Tg encapsulation material.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND EN 3838T is a black, thixotropic coating liquid for encapsulating components on PCBs. It's typically used for CSP and BGA package applications. It's formulated with an epoxy-based resin and cures fast at moderate temperatures. When cured, it provides physical protection, stable electronic performance, and temperature/humidity/bias testing protection.
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Low modulus
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Highly reworkable
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Fast curing
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Thixotropic for ease of application
- Product category:
- Encapsulants
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 217.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 57.0 ppm/°C
- Cure schedule, @ 130.0 °C:
- 8.0 min.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 2.0 °C
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 6700.0 mPa·s (cP)
