Film adhesives
Film adhesive ideal for microwave circuitry and heat sink attach applications
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
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Thin, uniform bondline control
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Silver filled
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RF/EMI shielding
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Electrically conductive in x, y and z axes
- Product category:
- Film adhesives
Technologies:
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Thermosets, electronics assembly materials
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Thermosets, 2K general epoxy
- Agency approvals / certificates / specifications:
- MIL standard 883 (method 5011)
- Cure schedule, @ 150.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 90.0 °C
- Physical form:
- Film
- Shear strength, Aluminum:
- 2000.0 psi
- Thermal conductivity:
- 6.5 W/mK
