Henkel Adhesive Technologies

Henkel Adhesive Technologies

Film adhesives

LOCTITE® ABLESTIK 5025E

Film adhesive ideal for microwave circuitry and heat sink attach applications  

This silver filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities . 

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For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver filled, electrically conductive, thin film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements. 

Agency approvals / certificates / specifications:

MIL Standard 883, Method 5011

Cure schedule, @ 150.0 °C:

30.0 min.

Cure type:

Heat Cure

Glass transition temperature (Tg):

90.0 °C

Physical form:

Film

Shear strength, Aluminum:

2000.0 psi

Thermal conductivity:

6.5 W/mK

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