Potting compounds
Heat- and humidity resistant, solvent-free potting adhesive
This soft, solvent-free, 2-part polyurethane potting material is low density and low viscosity, and has excellent heat and humidity resistance.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
TEROSON® PU U333/U102 is a potting material specially adapted for encapsulating electronic components for protection against mechanical stress and environmental attacks. This soft, solvent-free material has excellent heat and humidity resistance, as well as great adhesion on many plastics and metals.
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Solvent free
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Excellent heat resistance
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Excellent humidity resistance
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Great adhesion
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Fast gelling
- Product category:
- Encapsulants
Technologies:
-
2K liquid
- Applications:
- Encapsulating
- Key characteristics:
- Heat resistant,Humidity resistant,Viscosity: low viscosity
- Number of components:
- 2 part
