Underfills
Void-free underfill for very fine area array devices
This 1-part, epoxy-based underfill encapsulant is designed for use on flip-chip devices with as small as 25 μm geometries.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND E 1172 A is a void-free, epoxy-based underfill encapsulant designed for use on very fine area array devices where SMT transparent processing is critical. It can be used on flip-chip devices with as small as 25-micron geometries. When applied, it provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.
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Void-free
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Provides a uniform encapsulation
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Suitable for very fine area array devices
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Strong adhesive force
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Cure schedule, @ 135.0 °C:
- 6.0 min.
- Glass transition temperature (Tg):
- 135.0 °C
- Viscosity, Brookfield, Spindle 3, speed 5 rpm:
- 17000.0 mPa·s (cP)
