Henkel Adhesive Technologies

Henkel Adhesive Technologies

Underfills

LOCTITE® ECCOBOND E 1172 A

One-part, void-free underfill for very fine area array devices

One-part, epoxy-based underfill encapsulant for use on flip-chip devices with as small as 25 μm geometries.

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Information

When you want an underfill designed for use on very fine area array devices where SMT transparent processing is critical, LOCTITE® ECCOBOND E 1172 A is an excellent choice. This void-free, epoxy-based underfill encapsulant can be used on flip-chip devices with as small as 25-micron geometries. When applied, LOCTITE® ECCOBOND E 1172 A provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.

Cure schedule, @ 135.0 °C:

6.0 min.

Glass transition temperature (Tg):

135.0 °C

Viscosity, Brookfield, Spindle 3, speed 5 rpm:

17000.0 mPa·s (cP)

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