From desktop to laptop to data center, every leap in performance begins with a packaging decision most people will never see. Explore the rooms of the exhibition, discover the beauty of those decisions, and see our range of innovative applications.
1998, polymer on silicon, dimensions variable
Every arc is deliberate, every wire placed with a precision measured in microns, repated billions of times a day without ever asking to be noticed.
2004, solder on substrate, dimensions variable
Every bump is a promise of conductivity. Together they form a geometry so dense it becomes its own kind of beauty.
2012, encapsulant on silicon, undivided
Each square is identical. Each one will go its own way. This is the last moment they exist together.
2019, chiplet on interposer, assembled
Sizes and functions vary, origins differ, but the surface they share is where real performance begins.
2026, medium and dimensions to be confirmed
This frame stays empty until the right collaboration fills it. The first mark has been made. What comes next depends on the conversation we have not yet had.
We hope our way of combining art and technology was a memorable experience. If you need expert advice on how you can use highly engineered materials to boost performance in your semiconductor packaging, we're ready to talk.