1998, polymer on silicon, dimensions variable
Every arc is deliberate, every wire placed with a precision measured in microns, repated billions of times a day without ever asking to be noticed.
2004, solder on substrate, dimensions variable
Every bump is a promise of conductivity. Together they form a geometry so dense it becomes its own kind of beauty.
2012, encapsulant on silicon, undivided
Each square is identical. Each one will go its own way. This is the last moment they exist together.
2019, chiplet on interposer, assembled
Sizes and functions vary, origins differ, but the surface they share is where real performance begins.
2026, medium and dimensions to be confirmed
This frame stays empty until the right collaboration fills it. The first mark has been made. What comes next depends on the conversation we have not yet had.