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Henkel Adhesive Technologies
Phase change materials
BERGQUIST® HI FLOW THF 1600G
Electrically insulating reinforced pad
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced, electrically insulating pad
BERGQUIST® GAP PAD® TGP 2000
Thermally conductive, reinforced pad for low-stress applications
Thermal gels
BERGQUIST® LIQUI FORM TLF 3800LVO
For silicone-sensitive applications
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP 1800
Electrically insulating, fibreglass-reinforced - exceptional performance
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 4400LVO
Next generation gap filler for electronic assembly applications
BERGQUIST® SIL PAD® TSP 1800ST
Thermally conductive soft pad material with natural tack on both sides
BERGQUIST® GAP PAD® TGP 1500
Soft, electrically insulating pad - cost-effective
BERGQUIST® GAP PAD® TGP 1350
Reworkable, thermally conductive pad for fragile components
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
BERGQUIST® GAP FILLER TGF 3000SF
Blue silicone-free gap filler
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid
