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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 1350
Reworkable, thermally-conductive gap pad for fragile components
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
BERGQUIST® GAP PAD® TGP 2000
Thermally conductive, reinforced gap filler for low-stress applications
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP A2000
Thermally conductive, tacky-both-sides, fiberglass-reinforced insulating material
Thermal gels
BERGQUIST® LIQUI FORM TLF 3800LVO
For silicone sensitive applications
BERGQUIST® LIQUI FORM TLF 10000
High performance, telecom market applications
Phase change materials
BERGQUIST® HI FLOW THF 1500P
Electrically insulating, reinforced pad
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally-conductive gel for demanding applications
LOCTITE® TCP 4000D
Dispensable paste - low thermal impedance
LOCTITE® TCP 4000 PM
Printable paste - low thermal impedance
BERGQUIST® LIQUI FORM TLF LF3500
For demanding, stay-in-place applications
BERGQUIST® HI FLOW THF 1600G
