Compounds for electronics

One-part, heat-resistant epoxy adhesive

Isocyanate-based casting resin hardener

One-part, heat-curing epoxy potting compound

One-part, dual-cure adhesive ideal for potting or sealing applications 

Dual cure, flowable, fluorescent, medium-strength liquid sealant 

Thermal and mechanical shock resistant silicone

Self-levelling with long open time

Solvent-free conformal coating for protection from moisture and harsh chemicals 

One-part underfill compatible with small gap sizes

No-flow encapsulant designed for local circuit board protection 

Flame retardant, thermally conductive, non-corrosive potting product 

Transparent resin conformal coating containing no chlorinated solvents or CFCs