Compounds for electronics

Flexible encapsulant for Pb-free applications

Epoxy encapsulant for protecting bare semiconductor devices 

High purity encapsulant for applications utilizing lead-free solder

Heat- and humidity resistant, solvent-free potting adhesive 

Polyurethane resin for range of hardeners

High-performance black polyamide with cold temperature flexibility   

High-performance, black polyamide offering high strength and hardness 

Silicone-based potting compound and sealant

Polyurethane black hardener that when mixed with the appropriate resin forms a low-shrinkage, low-exotherm potting compound.

One-part, heat-resistant epoxy adhesive

Two-part, thermally conductive epoxy encapsulant

Curing agent/hardener for use with potting and encapsulating resins