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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
Thermal SIL PAD Materials
BERGQUIST® SIL PAD TSP 1800
Electrically insulating, fibreglass reinforced - exceptional performance
Phase change materials
LOCTITE® TCP 4000 PM
Printable paste - low thermal impedance
BERGQUIST® SIL PAD® TSP A2000
Thermally conductive, tacky-both-sides, fiberglass-reinforced insulating material
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3000SF
Blue, 2-part, silicone-free gap filler
BERGQUIST® GAP FILLER TGF 1000SR
Thermally conductive, liquid gap-filler material
BERGQUIST® HI FLOW THF 1600G
Electrically insulating, reinforced pad
BERGQUIST® GAP FILLER TGF 4400LVO
Next generation gap-filler for electronic assembly applications
BERGQUIST® GAP PAD TGP 12000ULM
Extremely soft, electrically insulating pad - exceptional thermal conductivity
BERGQUIST® SIL PAD TSP Q2500
Electrically conductive, aluminum foil reinforced pad - maximum heat transfer
BERGQUIST® SIL PAD® TSP 1600S
Electrically insulating pad - general purpose