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Henkel Adhesive Technologies
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid
BERGQUIST® GAP FILLER TGF 4400LVO
Next generation gap filler for electronic assembly applications
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB SA2005RT
Dispensable liquid for structural component bonding - high performance
BERGQUIST® GAP FILLER TGF 1000SR
Thermally conductive dispensable liquid
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP EMI 4000
Multifunctional gap pad for electromagnetic radiation absorption
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
BERGQUIST® SIL PAD® TSP 1600
Electrically insulating pad - highly compliant soft material
Phase change materials
BERGQUIST® HI FLOW THF 1600G
Electrically insulating reinforced pad
Thermal gels
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally conductive gel for demanding applications
LOCTITE® TCP 4000D
Dispensable paste - low thermal impedance
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced, electrically insulating pad