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Henkel Adhesive Technologies
Potting compounds
LOCTITE® SI 5631
Flame retardant, thermally conductive, non-corrosive potting product
Thermal GAP PAD Materials
BERGQUIST® GAP PAD TGP 7000ULM
Extremely soft, electrically insulating pad - high performance
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 1000SR
Thermally conductive, liquid gap-filler material
BERGQUIST® GAP FILLER TGF 4000
Versatile, high-performance dispensable liquid
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally-conductive gap filler
BERGQUIST® GAP FILLER TGF 1450
Versatile, cost-effective dispensable liquid
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB SA2000
Dispensable liquid adhesive for structural component bonding
BERGQUIST® GAP FILLER TGF 1500LVO
Versatile dispensable liquid with low outgassing
BERGQUIST® TGF 3010APS
High performance gap-filler for e-mobility battery applications
Thermal gels
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
High performance, silicone-free post-cure gel for automotive electronics
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
BERGQUIST® GAP PAD® TGP 2000
Thermally conductive, reinforced gap filler for low-stress applications