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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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  • Individual Packshot for LOCTITE SI 5631 in a black bucket

    Potting compounds

    LOCTITE® SI 5631

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    Flame retardant, thermally conductive, non-corrosive potting product 

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  • A packshot of BERGQUIST GAP PAD TGP 7000ULM showing grey sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD TGP 7000ULM

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    Extremely soft, electrically insulating pad - high performance

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  • A packshot of BERGQUIST GAP FILLER TGF 1000SR showing violet and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1000SR

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    Thermally conductive, liquid gap-filler material

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  • A packshot of BERGQUIST GAP FILLER TGF 4000 showing blue and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 4000

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    Versatile, high-performance dispensable liquid

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  • A packshot of BERGQUIST GAP FILLER TGF 1400SL showing yellow and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1400SL

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    Self-leveling, injectable, thermally-conductive gap filler

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  • A packshot of BERGQUIST GAP FILLER TGF 1450 showing blue and light blue 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1450

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    Versatile, cost-effective dispensable liquid

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  • A packshot of BERGQUIST LIQUI BOND TLB SA2000 showing a pale yellow 30CC syringe and 600CC cartridge.

    Thermally conductive adhesives

    BERGQUIST® LIQUI BOND TLB SA2000

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    Dispensable liquid adhesive for structural component bonding

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  • A packshot of BERGQUIST GAP FILLER TGF 1500LVO showing yellow and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1500LVO

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    Versatile dispensable liquid with low outgassing

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  • A packshot of BERGQUIST GAP FILLER TGF 3010APS showing 200L drum

    Thermal gap fillers

    BERGQUIST® TGF 3010APS

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    High performance gap-filler for e-mobility battery applications

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  • This is a product packshot for BERGQUIST LIQUI FORM TLF 4500CGEL-SF

    Thermal gels

    BERGQUIST® LIQUI FORM TLF 4500CGEL-SF

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    High performance, silicone-free post-cure gel for automotive electronics  

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  • A packshot of BERGQUIST GAP PAD TGP EMI1000 showing black sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP EMI1000

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    High-conformable gap pad combining thermal dissipation and EMI absorption

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  • A packshot of BERGQUIST GAP PAD TGP 2000 showing grey sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 2000

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    Thermally conductive, reinforced gap filler for low-stress applications 

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