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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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  • A packshot of BERGQUIST GAP PAD TGP EMI1000 showing black sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP EMI1000

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    High-conformable gap pad combining thermal dissipation and EMI absorption

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  • A packshot of BERGQUIST SIL PAD TSP 1800 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD TSP 1800

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    Electrically insulating, fibreglass reinforced - exceptional performance

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  • A packshot of LOCTITE TCP 4000 PM showing a gray 300ML semco cartridge.

    Phase change materials

    LOCTITE® TCP 4000 PM

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    Printable paste - low thermal impedance

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  • A packshot of BERGQUIST SIL PAD TSP A2000 showing light green sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD® TSP A2000

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    Thermally conductive, tacky-both-sides, fiberglass-reinforced insulating material

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  • Phase change materials

    BERGQUIST® HI FLOW THF 5000UT

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    Thin bond line, low pressure - for advanced devices

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  • A product packshot showing BERGQUIST GAP FILLER TGF 3000SF in 3 different sized dual cartridges

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 3000SF

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    Blue, 2-part, silicone-free gap filler

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  • A packshot of BERGQUIST GAP FILLER TGF 1000SR showing violet and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1000SR

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    Thermally conductive, liquid gap-filler material

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  • A packshot of BERGQUIST HI FLOW THF 1600G showing green sheets, die cuts, and die cut roll.

    Phase change materials

    BERGQUIST® HI FLOW THF 1600G

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    Electrically insulating, reinforced pad

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  • Packshot for BERGQUIST GAP FILLER TGF 4400LVO, part a and part b pail

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 4400LVO

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    Next generation gap-filler for electronic assembly applications

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  • A packshot of BERGQUIST GAP PAD TGP 12000ULM showing a grey gap pad.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD TGP 12000ULM

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    Extremely soft, electrically insulating pad - exceptional thermal conductivity

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  • A packshot of BERGQUIST SIL PAD TSP Q2500 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD TSP Q2500

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    Electrically conductive, aluminum foil reinforced pad - maximum heat transfer

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  • A packshot of BERGQUIST SIL PAD TSP 1600S showing pink sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD® TSP 1600S

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    Electrically insulating pad - general purpose

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