Thermal SIL PAD Materials
Electrically insulating pad - highly compliant soft material
This thermally conductive, silicone insulator pad features minimal thermal resistance and maximum thermal performance. Low mounting stress.
Marketing materials
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® SIL PAD® TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass-reinforced material with smooth surface texture is electrically isolating and ideal for applications requiring low mounting pressures.
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Thermal impedance: 0.45°C (32.8°F) -in2/W (@50 psi)
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Value material
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Smooth and highly compliant surface
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Electrically isolating
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Low mounting pressures
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermal management, sil pads
- Carrier film thickness:
- 0.025 mm
- Dielectric breakdown voltage:
- 3000.0 Vac
- Dielectric constant, @ 1kHz:
- 6.0
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 180.0 °C
- Phase change temperature:
- 55.0 °C
- Shore hardness, ASTM D2240, Shore A:
- 91.0
- Standard thickness:
- 0.127 mm
- Thermal conductivity:
- 1.6 W/mK
- Thermal impedance, ASTM D5470, @ 50 psi:
- 0.45 °C-in²/W
- Volume resistivity:
- 1×10 Ohm m
