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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal SIL PAD Materials

BERGQUIST® SIL PAD TSP 1600

Electrically insulating pad - highly compliant soft material

Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.

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Information

BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Carrier film thickness:

0.025 mm

Dielectric breakdown voltage:

3000.0 Vac

Dielectric constant, @ 1kHz:

6.0

Flame rating:

V-0

Operating temperature:

-60.0 °C - 180.0 °C

Phase change temperature:

55.0 °C

Shore hardness, ASTM D2240, Shore A:

91.0

Standard thickness:

0.127 mm

Thermal conductivity:

1.6 W/mK

Thermal impedance, ASTM D5470, @ 50 psi:

0.45 °C-in²/W

Volume resistivity:

1×10 Ohm m

Associated industries and market segments

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