Thermal SIL PAD Materials
Electrically insulating pad - highly compliant soft material
Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-
Thermal impedance: 0.45°C-in2/W (@50 psi)
-
Value material
-
Smooth and highly compliant surface
-
Electrically isolating
-
Low mounting pressures
- Product category:
- Thermal SIL PAD Materials
Technologies:
-
Thermal management, sil pads
- Carrier film thickness:
- 0.025 mm
- Dielectric breakdown voltage:
- 3000.0 Vac
- Dielectric constant, @ 1kHz:
- 6.0
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 180.0 °C
- Phase change temperature:
- 55.0 °C
- Shore hardness, ASTM D2240, Shore A:
- 91.0
- Standard thickness:
- 0.127 mm
- Thermal conductivity:
- 1.6 W/mK
- Thermal impedance, ASTM D5470, @ 50 psi:
- 0.45 °C-in²/W
- Volume resistivity:
- 1×10 Ohm m
