Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal SIL PAD Materials

BERGQUIST® SIL PAD TSP Q2500

Electrically conductive, aluminum foil reinforced pad - maximum heat transfer

Thermally conductive, aluminum foil coated pad for applications where maximum heat transfer is needed but electrical isolation is not required. Low thermal impedance.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

BERGQUIST® SIL PAD TSP Q2500 is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. It is an ideal thermal interface material to replace messy thermal grease compounds - eliminating problems associated with grease, such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. It also eliminates dust collection, which can cause possible surface shorting or heat buildup.

Color:

Pink

Operating temperature:

-60.0 °C - 180.0 °C

Thermal conductivity:

1.2 W/mK

Please contact us for ordering options

There are some errors, please correct them below.

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.