Thermal SIL PAD Materials
Electrically conductive, aluminum foil reinforced pad - maximum heat transfer
Thermally conductive, aluminum foil coated pad for applications where maximum heat transfer is needed but electrical isolation is not required. Low thermal impedance.
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- Technical specification
BERGQUIST® SIL PAD TSP Q2500 is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. It is an ideal thermal interface material to replace messy thermal grease compounds - eliminating problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. BERGQUIST SIL PAD TSP Q2500 also eliminates dust collection which can cause possible surface shorting or heat buildup.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 180.0 °C