Part no. (SKU/IDH):
2859970
IDH Name:
BERGQUIST® SIL PAD® TSP Q2500
Thermal SIL PAD Materials
Electrically conductive, aluminum-foil-reinforced pad - maximum heat transfer
This thermally conductive, aluminum foil coated pad is designed for applications where maximum heat transfer is needed but electrical isolation is not required. Low thermal impedance.
Marketing materials
Part no. (SKU/IDH):
2859970
IDH Name:
BERGQUIST® SIL PAD® TSP Q2500
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
BERGQUIST® SIL PAD® TSP Q2500 is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad® rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. It is an ideal thermal interface material to replace messy thermal grease compounds, eliminating problems associated with grease, such as contamination of reflow solder or cleaning operations. Unlike grease, this product can be used prior to these operations. It also eliminates dust collection, which can cause possible surface shorting or heat buildup.
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Thermal impedance: 0.22°C (32°F) -in2/W (@50 psi)
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Maximum heat transfer
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Designed to replace thermal grease
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Aluminum foil coated both sides
- Product category:
- Thermal SIL PAD Materials
Technologies:
-
Sil pads
- Color:
- Pink
- Operating temperature:
- -60.0 °C - 180.0 °C
- Thermal conductivity:
- 1.2 W/mK
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Large volume or special order?
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