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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal SIL PAD Materials

BERGQUIST® SIL PAD TSP Q2000

Electrically conductive fibreglass-reinforced pad - withstands processing stress

Thermally conductive, fiberglass-reinforced, silicone insulator pad suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

Carrier type:

Fiberglass

Color:

Black

Flame rating:

V-0

Operating temperature:

-60.0 °C - 180.0 °C

Thermal conductivity:

0.2 W/mK

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