Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal SIL PAD Materials


Electrically conductive fibreglass-reinforced pad - withstands processing stress

Thermally conductive, fiberglass-reinforced, silicone insulator pad suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options



BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

Carrier type:




Flame rating:


Operating temperature:

-60.0 °C - 180.0 °C

Thermal conductivity:

0.2 W/mK

Please contact us for ordering options

There are some errors, please correct them below.

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.