BERGQUIST^® SIL PAD^® TSP Q2000

BERGQUIST^® SIL PAD^® TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. It can be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.