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Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

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Consumer demand for high-speed network access, cloud storage, and advanced analytics is driving the need for robust datacenter solutions. Datacenter interconnect (DCI) and 400GE technology are enhancing data switching and routing performance. To meet these demands, Henkel provides cutting-edge adhesives, coatings, and sealants that ensure the reliability and longevity of high-performance computing components in cloud/hyperscale datacenters.

Key insights

Find out about Henkel's diverse TIMs, including pads, films, liquids, and gels, to enhance thermal management and reliability in high-power density line cards and computing servers.
Discover how LOCTITE^® underfills enhance reliability and protect fine-pitch array components in high-performance computing and data processing ASICs.

Related products

Electrically conductive adhesives

LOCTITE^® SI 5421

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Flexible and shielding electrically conductive sealant and adhesive

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Electrically non-conductive adhesives

LOCTITE^® ABLESTIK QMI536NB

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General purpose non-conductive adhesive for stacked die applications

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Electrically conductive adhesives

LOCTITE^® ABLESTIK ABP 8068TB

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High performance adhesive with superior thermal and electrical conductivity

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Electrically conductive adhesives

LOCTITE^® ABLESTIK 2030SC

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General purpose electrically conductive adhesive for high-speed dispensing

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Thermally conductive adhesives

LOCTITE^® 315

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Self-shimming, thermally conductive, controlled-strength, activator-cured paste

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Thermal gels

BERGQUIST^® LIQUI FORM TLF 6000HG

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For telecom market applications requiring high gap fill

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Thermally conductive adhesives

BERGQUIST^® LIQUI BOND TLB SA3500

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Dispensable liquid for structural component bonding - extreme environments

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Thermally conductive adhesives

BERGQUIST^® LIQUI BOND TLB EA1800

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Dispensable liquid for structural component bonding - high strength

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Thermal GAP PAD Materials

BERGQUIST^® GAP PAD^® TGP HC3000

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Soft, fiberglass-reinforced insulation pad - low stress applications

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Thermal GAP PAD Materials

BERGQUIST^® GAP PAD^® TGP 7000ULM

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Extremely soft, electrically insulating pad - high performance

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Thermal GAP PAD Materials

BERGQUIST^® GAP PAD^® TGP 6000ULM

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Soft, electrically insulating pad - high performance

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Thermal GAP PAD Materials

BERGQUIST^® GAP PAD^® TGP 3500ULM

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Soft, fiberglass reinforced electrically insulating pad

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