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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP HC5000

Soft, fiberglass-reinforced insulation pad - high-performance

This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.

  • Product category:
  • Thermal GAP PAD Materials

Technologies:

  • Carrier type:
  • Fiberglass

 

  • Flame rating:
  • V-0

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Thermal conductivity:
  • 5.0 W/mK

 

  • Young's modulus, ASTM D575:
  • 121.0 KPa (17.5 psi)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

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