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      • This is a group packshot for BERGQUIST LIQUI FORM TLF 3500CGEL

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 3500CGEL

        Highly thermally conductive gel for demanding applications
      • A packshot of BERGQUIST LIQUI FORM TLF LF2000 showing a grey 30CC syringe and 600CC cartridge.

        Thermal gels

        BERGQUIST® LIQUI FORM TLF LF2000

        Gray, thermally conductive, silicone pre-cure gel
      • A packshot of BERGQUIST GAP PAD TGP 3004SF showing light grey sheets and die cuts.

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP 3004SF

        Soft, electrically insulating pad - silicone free
      • A packshot of BERGQUIST GAP PAD TGP 3000ULM showing a grey gap pad.

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP 3000ULM

        Soft, fiberglass reinforced, electrically insulating pad
      • A packshot of BERGQUIST SIL PAD TSP Q2000 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP Q2000

        Electrically conductive fibreglass-reinforced pad - withstands processing stress
      • A product packshot showing BERGQUIST GAP FILLER TGF 3000SF in 3 different sized dual cartridges

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 3000SF

        Blue silicone-free gap filler
      • A packshot of BERGQUIST BOND PLY TBP 1400LMS-HD showing yellow sheets, die cuts, and die cut roll.

        Thermally conductive adhesives

        BERGQUIST® BOND PLY TBP 1400LMS-HD

        Flexible, laminated material for structural component bonding
      • A packshot of BERGQUIST HI FLOW THF 1500P showing gold sheets, die cuts, and die cut roll.

        Phase change materials

        BERGQUIST® HI FLOW THF 1500P

        Electrically insulating reinforced pad
      • A packshot of BERGQUIST SIL PAD TSP Q2500 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP Q2500

        Electrically conductive, aluminum-foil-reinforced pad - maximum heat transfer
      • Packshot of BERGQUIST LIQUI-FORM TLF 10000 in syringe form

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 10000

        High-performance thermal interface gel for telecom market applications
      • A packshot of BERGQUIST SIL PAD TSP 900 showing grey sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP 900

        The original fiberglass-reinforced electrical insulator
      • This is a packshot of BERGQUIST GAP FILLER TGF 2900LVO in 50cc and 400cc cartridges

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 2900LVO

        Low volatile thermal gap filler for automotive electronic assemblies

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