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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 2200SF
Green, silicone-free, thermally conductive gap-filling material
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced electrically insulating pad
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3000SF
Blue, 2-part, silicone-free gap filler
Thermal gels
BERGQUIST® LIQUI FORM TLF LF2000
Gray, thermally conductive, silicone pre-cure gel
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP PPK900
Mauve, thermally conductive polyester insulator
BERGQUIST® GAP PAD® TGP 12000ULM
Extremely soft, electrically insulating pad - exceptional thermal conductivity
BERGQUIST® GAP PAD® TGP 1350
Reworkable, thermally-conductive gap pad for fragile components
BERGQUIST® GAP FILLER TGF 1000SR
Thermally conductive, liquid gap-filler material
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally-conductive gap filler
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
BERGQUIST® GAP FILLER TGF 4000
Versatile, high-performance dispensable liquid