Moisture, contaminants, corrosion, and thermal and mechanical stress can severely damage wire bonded chips on PCBs. Advanced board-level encapsulation technology protects against these conditions.
Browse our portfolio of board-level encapsulants and discover which materials may be appropriate for your application.
Board-level encapsulants are materials deposited over wire bonded chips attached to printed circuit boards (PCBs) to secure them against environmental and processing conditions that may affect performance and reliability. There are two primary processes: In the dam and fill encapsulant process, the deposition of an encapsulant border is followed by encapsulant filling within the border confines. The glob top encapsulant technique deposits material directly over the chip and wire bonds with no border.
Board-level encapsulants are used to ensure environmental protection and fortify the mechanical strength of wire bonded devices. Delicate wires and component leads are subjected to many processing stresses and challenging in-application conditions. Without encapsulation protection, electrical failure may result.
Expansive portfolio
High reliability
Excellent processability
Selecting the proper encapsulant chemistry and appropriate deposition equipment is vital to ensuring the best results. Henkel technical experts offer consultative expertise in product evaluation, selection, and process optimization.
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