Injection molding compounds
High-performance, black polyamide offering high strength and hardness
This high performance, low-viscosity polyamide is perfect for low pressure molding applications, especially those requiring both high strength and hardness, such as computer connectors and memory sticks.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TECHNOMELT® PA 646 is a black, low viscosity, thermoplastic material that allows encapsulation of fragile components without causing any damage, making it the ideal choice for low pressure molding applications. You can expect a good balance of high and low temperature performance, no toxic fumes in process, and excellent environmental and moisture resistance. Perfect when you need high strength and hardness, such as for computer connectors and memory sticks.
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Excellent moisture resistance
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Simplified process flow
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Easy moldability
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Good adhesion to a variety of substrates
- Product category:
- Injection molding compounds
Technologies:
-
Hot Melts, polyamide
- Applications:
- Encapsulating
- Color:
- Black
- Number of components:
- 1 part
