Thermally conductive adhesives
Dispensable liquid for structural component bonding - high strength
Silicone free, 2-part epoxy liquid for applications where mechanical and chemical stability is needed.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB EA1800 is a thermally-conductive epoxy liquid adhesive with excellent chemical and mechanical stability. The product cures at room temperature and creates a high bond strength, which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Thermal conductivity: 1.8 W/m-K (ASTM D5470)
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High bond strength, room temperature cure
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Silicone-free
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Accelerated cure through heat
- Product category:
- Thermally conductive adhesives
Technologies:
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Thermal management, speciality liquids
- Flame rating:
- V-0
- Hardener: Color:
- Light yellow
- Operating temperature:
- -40.0 °C - 125.0 °C
- Resin: Color:
- Gray
- Thermal conductivity:
- 1.8 W/mK
