Thermally conductive adhesives
Dispensable liquid for structural component bonding - high strength
This silicone-free, 2-part epoxy liquid is designed for applications where mechanical and chemical stability are needed.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB EA1800 is a thermally conductive epoxy liquid adhesive with excellent chemical and mechanical stability. The product cures at room temperature and creates high bond strength, which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion (CTE).
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Thermal conductivity: 1.8 W/m-K
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High bond strength, room temperature cure
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Silicone-free
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Accelerated cure through heat
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermally conductive adhesives
Technologies:
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Thermal management, speciality liquids
- Flame rating:
- V-0
- Hardener: Color:
- Light yellow
- Operating temperature:
- -40.0 °C - 125.0 °C
- Resin: Color:
- Gray
- Thermal conductivity:
- 1.8 W/mK
