Electrically conductive adhesives
Electrically conductive die-attach adhesive for high-throughput applications
A 1-part, BMI Hybrid-based, silver gray, conductive die-attach adhesive designed for high-throughput applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK QMI529HT-LV is a silver, thermally and electrically conductive die-attach adhesive for use in high-throughput applications. It offers good dispensing characteristics, low moisture absorption and low stress. It’s formulated with a BMI hybrid-based resin, is thermally stable at 260°C (500°F) reflow and cures when exposed to heat.
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Meets NASA outgassing standards
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Hydrophobic
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Stable at high temperatures
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Low moisture absorption and low stress
- Product category:
- Electrically conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 62.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Fluoride (F-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Hot die shear strength:
- 3.75 kg-f
- RT die shear strength:
- 20.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 738.0 N/mm² (107037.0 psi)
FAQ
Do not try to reduce the thawing time by rubbing the syringes between the hands or by use of any type of heating device. When ready to use the ECA, transfer the needed syringes from the syringe box in the freezer to a designated thaw area using thermal gloves. While frozen, only handle the syringe by the flanges located at the top end of the syringe. This will minimize thermal shock and reduce the likelihood of FTVs from forming. During thaw, the syringes should be stored in the vertical position. Thaw times vary depending on syringe size but are typically >1 hour.
To maximize adhesive performance, a clean substrate is required. Industry standard cleaning methods include solvent cleaning, mechanical abrasion / cleaning or chemical treatment.
There are many methods to dispense: auger pump, jet pump, time/ pressure. This is equipment and application specific, please check with your equipment vendor for their recommendations. The simplest approach that Henkel recommends is time/ pressure.
