Thermal gels
For telecom market applications requiring high gap fill
One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
Award-winning BERGQUIST® LIQUI FORM TLF 6000HG is a thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0mm, delivering robust vertical gap stability.
-
Dispensable pre-cured gel, requiring no mixing or refrigeration
-
Thermal conductivity: 6.0 W/m-K
-
Stable viscosity in storage and in the application
-
Excellent chemical stability and mechanical stability
-
Low compression set to reduce stress on components
- Product category:
- Thermal gels
Technologies:
-
Thermal management, ultra high viscosity liquids
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shelf life, @ 25.0 :
- 365.0 day
- Thermal conductivity:
- 6.0 W/mK
