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      • A packshot of LOCTITE TCP 4000 D showing a gray 300ML semco cartridge, a 610ML jar, and a 55CC EFD syringe.

        Phase change materials

        LOCTITE® TCP 4000D

        Dispensable paste - low thermal impedance
      • This is a group packshot for BERGQUIST LIQUI FORM TLF 3500CGEL

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 3500CGEL

        Highly thermally conductive gel for demanding applications
      • A packshot of BERGQUIST SIL PAD TSP Q2000 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP Q2000

        Electrically conductive fibreglass-reinforced pad - withstands processing stress
      • This is a product packshot for BERGQUIST LIQUI FORM TLF 4500CGEL-SF

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 4500CGEL-SF

        High performance, silicone-free post-cure gel for automotive electronics  
      • Packshot for BERGQUIST GAP FILLER TGF 4400LVO, part a and part b pail

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 4400LVO

        Next generation gap filler for electronic assembly applications
      • A packshot of BERGQUIST GAP FILLER TGF 1450 showing blue and light blue 50CC, 200CC, and 400CC kits.

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 1450

        Versatile, cost-effective dispensable liquid
      • Packshot for black adhesive of LOCTITE ABLESTIK TE 3530 in 3cc, 5cc, 10cc, 30cc

        Thermally conductive adhesives

        LOCTITE® ABLESTIK TE 3530

        Thermally conductive epoxy adhesive for heat dissipation components
      • A packshot of LOCTITE TCP 4000 PM showing a gray 300ML semco cartridge.

        Phase change materials

        LOCTITE® TCP 4000 PM

        Printable paste - low thermal impedance
      • packshot for black gap pad material BERGQUIST GAP PAD TGP EMI 4000

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP EMI 4000

        Multifunctional gap pad for electromagnetic radiation absorption
      • A packshot of BERGQUIST HI FLOW THF 1600G showing green sheets, die cuts, and die cut roll.

        Phase change materials

        BERGQUIST® HI FLOW THF 1600G

        Electrically insulating reinforced pad
      • A packshot of BERGQUIST SIL PAD TSP 1600 showing gold sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP 1600

        Electrically insulating pad - highly compliant soft material
      • A packshot of BERGQUIST GAP FILLER TGF 1400SL showing yellow and white 50CC, 200CC, and 400CC kits.

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 1400SL

        Self-leveling, injectable, thermally conductive liquid

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