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Henkel Adhesive Technologies
Phase change materials
LOCTITE® TCP 4000D
Dispensable paste - low thermal impedance
Thermal gels
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally conductive gel for demanding applications
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
High performance, silicone-free post-cure gel for automotive electronics
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 4400LVO
Next generation gap filler for electronic assembly applications
BERGQUIST® GAP FILLER TGF 1450
Versatile, cost-effective dispensable liquid
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
LOCTITE® TCP 4000 PM
Printable paste - low thermal impedance
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP EMI 4000
Multifunctional gap pad for electromagnetic radiation absorption
BERGQUIST® HI FLOW THF 1600G
Electrically insulating reinforced pad
BERGQUIST® SIL PAD® TSP 1600
Electrically insulating pad - highly compliant soft material
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid