Products

Epoxy-based, composite surfacing film for lightning strike protection

Curing agent/hardener for use with potting and encapsulating resins

Epoxy encapsulant for protecting bare semiconductor devices 

Epoxy hardener compatible with a number of LOCTITE^® products

One-part, void-free underfill for very fine area array devices

Thermally conductive, 2-part epoxy encapsulant

No-flow encapsulant designed for local circuit board protection 

High-performance black polyamide with cold temperature flexibility   

Epoxy dam and fill encapsulant with excellent handling 

One-part, heat-curing epoxy potting compound

Easily reworkable, fast-drying protection layer​ for circuit boards

One-part, halogen-free epoxy underfill for shock and drop protection