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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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  • A packshot of LOCTITE TCP 4000 D showing a gray 300ML semco cartridge, a 610ML jar, and a 55CC EFD syringe.

    Phase change materials

    LOCTITE® TCP 4000D

    Dispensable paste - low thermal impedance

  • This is a group packshot for BERGQUIST LIQUI FORM TLF 3500CGEL

    Thermal gels

    BERGQUIST® LIQUI FORM TLF 3500CGEL

    Highly thermally conductive gel for demanding applications

  • A packshot of BERGQUIST SIL PAD TSP Q2000 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD® TSP Q2000

    Electrically conductive fibreglass-reinforced pad - withstands processing stress

  • This is a product packshot for BERGQUIST LIQUI FORM TLF 4500CGEL-SF

    Thermal gels

    BERGQUIST® LIQUI FORM TLF 4500CGEL-SF

    High performance, silicone-free post-cure gel for automotive electronics  

  • Packshot for BERGQUIST GAP FILLER TGF 4400LVO, part a and part b pail

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 4400LVO

    Next generation gap filler for electronic assembly applications

  • A packshot of BERGQUIST GAP FILLER TGF 1450 showing blue and light blue 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1450

    Versatile, cost-effective dispensable liquid

  • Packshot for black adhesive of LOCTITE ABLESTIK TE 3530 in 3cc, 5cc, 10cc, 30cc

    Thermally conductive adhesives

    LOCTITE® ABLESTIK TE 3530

    Thermally conductive epoxy adhesive for heat dissipation components

  • A packshot of LOCTITE TCP 4000 PM showing a gray 300ML semco cartridge.

    Phase change materials

    LOCTITE® TCP 4000 PM

    Printable paste - low thermal impedance

  • packshot for black gap pad material BERGQUIST GAP PAD TGP EMI 4000

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP EMI 4000

    Multifunctional gap pad for electromagnetic radiation absorption

  • A packshot of BERGQUIST HI FLOW THF 1600G showing green sheets, die cuts, and die cut roll.

    Phase change materials

    BERGQUIST® HI FLOW THF 1600G

    Electrically insulating reinforced pad

  • A packshot of BERGQUIST SIL PAD TSP 1600 showing gold sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD® TSP 1600

    Electrically insulating pad - highly compliant soft material

  • A packshot of BERGQUIST GAP FILLER TGF 1400SL showing yellow and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1400SL

    Self-leveling, injectable, thermally conductive liquid