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Henkel Adhesive Technologies
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
LOCTITE® ABLESTIK 8700K
Non-slump, die-attach adhesive for gold film surfaces
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 7000ULM
Extremely soft, high performance electrically insulating pad
BERGQUIST® GAP PAD® TGP 12000ULM
Extremely soft, electrically insulating pad with exceptional thermal conductivity
LOCTITE® TLB 9300 APSi
High bond strength, thermally conductive, electrically insulating adhesive
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
BERGQUIST® GAP PAD® TGP 2400
Soft, fibreglass-reinforced insulation pad - low stress applications
BERGQUIST® LIQUI BOND TLB SA2005RT
Dispensable liquid for structural component bonding - high performance
Thermal gels
BERGQUIST® LIQUI FORM TLF 6500CGEL-SF
Silicone-free, post-cure gel for automotive electronics
LOCTITE® TCP 7000
Printable paste for high operating temperature
LOCTITE® TCP 4000D
Dispensable paste - low thermal impedance
LOCTITE® TCP 4000 PM
Printable paste - low thermal impedance
