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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermally conductive adhesives

BERGQUIST® LIQUI BOND TLB SA2005RT

Dispensable liquid for structural component bonding - high performance

2-part silicone adhesive for high performance automotive electronics applications where thermal conductivity is needed.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH) 2213988
BERGQUIST® LIQUI BOND TLB SA2005RT, 50 ml Dual cartridge

Documents

Information

BERGQUIST® LIQUI BOND TLB SA2005RT functions as a thermal interface material as well as a structural adhesive. It is ideal for demanding automotive applications like electronics, power supplies pumps, and automotive modules. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Cure type:

Heat cure,Room temperature (ambient) cure

Operating temperature:

-60.0 °C - 180.0 °C

Shelf life:

6.0 mon.

Storage temperature:

25.0 °C

Thermal conductivity:

2.0 W/mK

Associated industries and market segments

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