Thermally conductive adhesives
Dispensable liquid adhesive for structural component bonding - high performance
2-part silicone adhesive for high performance automotive electronics applications where thermal conductivity is needed.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2213989
- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB SA2005RT functions as a thermal interface material as well as a structural adhesive. It is ideal for demanding automotive applications like electronics, power supplies pumps, and automotive modules. This product is curable at room temperature, however, the cure rate can also be accelerated with application of heat.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Thermal conductivity: 2.0 W/m-K (ASTM D5470)
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High bond strength
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Adaptable cure mechanism
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High elongation modulus
Cure type:
Heat Cure,Room Temperature (Ambient) Cure
Operating temperature:
-60.0 °C - 180.0 °C
Shelf life:
6.0 mon.
Storage temperature:
25.0 °C
Thermal conductivity:
2.0 W/mK
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