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Henkel Adhesive Technologies
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
Thermal gels
BERGQUIST® LIQUI FORM TLF 6500CGEL-SF
Silicone-free, post-cure gel for automotive electronics
Phase change materials
LOCTITE® TCP 7000
Printable paste for high operating temperature
BERGQUIST® HI FLOW THF 1600G
Electrically insulating reinforced pad
BERGQUIST® BOND PLY TBP 1400LMS-HD
Flexible, laminated material for structural component bonding
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 5000
Soft, fiberglass-reinforced insulation pad - high performance
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
BERGQUIST® SIL PAD® TSP A2000
Thermally conductive, tacky, fiberglass-reinforced insulating material
BERGQUIST® GAP PAD® TGP 1500
Soft, electrically insulating pad - cost-effective
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally conductive gel for demanding applications
