Thermally conductive adhesives
Flexible, laminated material for structural component bonding
Highly durable, thermally conductive material that is ideal for securing power components and PCBs to a heat sink. Eliminates mechanical fasteners.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® BOND PLY TBP 1400LMS-HD is a highly durable laminate material that is heat curable and eliminates the need for mechanical fasteners. The high performance, flexible silicone design provides exceptional thermal range and effectively absorbs vibrations and other mechanical stresses caused during the assembly process.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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TO-220 Thermal performance: 2.3°C/W, initial pressure only lamination
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200 psi adhesion strength
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200 psi adhesion strength
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Very low interfacial resistance
Carrier type:
Fiberglass
Color:
Yellow
Flame rating:
V-0
Operating temperature:
-60.0 °C - 180.0 °C
Storage temperature:
5.0 °C - 25.0 °C
Thermal conductivity:
1.4 W/mK
FAQ
BOND PLY product testing has been completed on various interface materials. These tests have demonstrated that improper surface wet-out is the single largest variable associated with maximizing bond strength and heat transfer. We have found that reducing the size of the interface pad to roughly 80% of the total interface area actually improves the overall bonding performance while offering significant improvements in total package cooling. Henkel offers three standard thicknesses for BERGQUIST® BOND PLY TBP 850, allowing each application to be optimized in three dimensions.
The answer to this varies from application to application, depending upon surface roughness and flatness. In general, pressure, temperature and time are the primary variables associated with increasing surface contact or wetout. Increasing the application time and/or pressure will significantly increase surface contact. Natural wet-out will continue to occur with BOND PLY materials. This inherent action often increases bond strength by more than two times within the first 24 hours
Adhesive performance on plastic packages is primarily a function of surface contact or wet-out. If surface contaminants such as plastic mold release oils are present, this will prevent contact and/or bonding to the surface. Make sure all surfaces are clean and dry prior to applying BOND PLY materials.