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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal SIL PAD Materials

BERGQUIST® SIL PAD® TSP A2000

Thermally conductive, tacky-both-sides, fiberglass-reinforced insulating material

Thermally conductive, fiberglass-reinforced silicone insulator pad, which performs well under clamping pressure. Perfect for high performance applications requiring electrical isolation and cut-through resistance.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you’re working with high performance applications where electrical isolation and cut-through resistance are paramount, try BERGQUIST® SIL PAD TSP A2000. This electrically insulating, silicone based, thermally-conductive material consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. It performs brilliantly under clamping pressure up to 200 psi, and is offered as 305 mm x 305 mm (12" x 12") sheets, 305 mm x 250 rolls (12" x 250 rolls) or in custom configuration on request.

  • Product category:
  • Thermal SIL PAD Materials

Technologies:

  • Carrier film thickness:
  • 0.051 mm

 

  • Dielectric breakdown voltage:
  • 6000.0 Vac

 

  • Dielectric constant, @ 1kHz:
  • 7.0

 

  • Flame rating:
  • V-0

 

  • Operating temperature:
  • -60.0 °C - 180.0 °C

 

  • Phase change temperature:
  • 60.0 °C

 

  • Shore hardness, ASTM D2240, Shore A:
  • 80.0

 

  • Standard thickness:
  • 0.254 mm

 

  • Thermal conductivity:
  • 2.0 W/mK

 

  • Thermal impedance, ASTM D5470, @ 50 psi:
  • 0.42 °C-in²/W

 

  • Volume resistivity:
  • 1×10 Ohm m

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

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