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What factors should be considered when selecting a thermal management solution?

Learn about the factors that determine thermal management material selection for packaging power electronics.

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When designing a new device or system, what are the most important criteria for selecting a thermal management material for the application? If you answered thermal conductivity – also known as lambda value – you’re not alone. And you’d be a little bit right…but not completely. Thermal conductivity is an essential factor, but it’s not everything when it comes to the final result. Other considerations include processability, curing mechanisms, adhesion characteristics, thermal impedance/interfacial resistance, base chemistry, bond line thickness, and so on. This article will explain the role of TIMs, what variables to consider, and provide information on selecting a material that’s fit for purpose.

Key insights

The basic function and form of thermal management solutions
Selecting the right thermal management solution for an application
The role of thermal management solutions in the factory of the future

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What factors should be considered when selecting a thermal management solution?

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Learn more about our thermal material management solutions in our product guide.

Looking for solutions? We can help

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What factors should be considered when selecting a thermal management solution?

Get access now

Key insights

Related products

Related content

Automation-friendly liquid gap filler delivers on thermal control

Learn how a manufacturer of a power converter used thermal management materials to create a more efficient product.

Henkel optimizes thermal performance for an industrial autonomous guided vehicle

Learn how the manufacturer of an autonomous guided vehicle dissipated heat for optimized function with Henkel thermal management materials.

Improving power module reliability with LOCTITE® phase change material

Learn how a new drive system design removed operational heat with thermal management materials.

BERGQUIST® LIQUI-BOND® delivers efficient solution for data center power supply

Learn how a manufacturer of an AC/DC power supply leverages a robust thermal management solution for its compact design.

How does fracture toughness work with thermally conductive adhesives?

Learn how thermally conductive adhesives can provide advantages over traditional mechanical fastening.

How can thermal interface materials help with packaging power electronics?

Learn about the variety of formats and performance attributes of thermal interface materials for packaging power electronics.

How can thermally conductive liquid materials help for electronics packaging

Learn about the performance, manufacturing, and reliability issues related to thermally conductive liquids. Significant differences with respect to solid pad like materials and unfilled liquids will be explored.

How to choose the right thermal management material?

Learn more about our thermal material management solutions in our product guide.

Looking for solutions? We can help

Company

Help

Resource center

Social media

Improving power module reliability with LOCTITE^® phase change material

BERGQUIST^® LIQUI-BOND^® delivers efficient solution for data center power supply