Thermal gap fillers
Low volatile thermal gap filler for automotive electronic assemblies
This 2-part, 2.9W/(m.K), low volatile silicone-based thermal gap filler is ideal for automotive electronic assemblies.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 2900LVO is a silicone, 2-part, room-temperature-curable gap filler suitable for use in a wide range of electronic assembly applications. With a thermal conductivity of 2.9 W/(m.K) and the ability to achieve ultra-thin bond line thickness, it provides an excellent and versatile solution to optimize heat dissipation in challenging conditions. This material is an exceptional choice for automotive, industrial and consumer electronic applications.
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2-parts: mixing required
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24-hour pot-life
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Excellent handling properties and robust dispensing
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Medium thermal conductivity
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
