Thermal gap fillers
Two component low volatile silicone-based thermal gap filler ideal for automotive electronic assemblies
BERGQUIST GAP FILLER TGF 2900LVO is a 2.9W/(m.K), two component low volatile silicone-based thermal gap filler ideal for automotive electronic assemblies.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 2900LVO is a silicone, 2-part room temperature curable gap filler suitable for use in a wide range of electronic assembly applications. With a thermal conductivity of 2.9 W/(m.K) and a possibility to achieve ultra-thin bondline thickness, it provides an excellent and versatile solution to optimize heat dissipation in challenging conditions. This material is an exceptional choice for the use in automotive, industrial and consumer electronic applications.
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2-component solution based on low volatile silicone technology
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Long working time, cures within 24 hours at room temperature
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Excellent handling properties and robust dispensing
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Medium thermal conductivity
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
