Structural adhesives
High-performance structural bonder for heat-sensitive components
A 1-part epoxy adhesive designed to cure at low temperatures. Provides quick and powerful adhesion on delicate electronic components.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® 3128 is a 1-part, heat-curable epoxy designed for use on small, heat-sensitive components. Typical applications include things like memory cards and CCD/CMOS assemblies. It cures at low temperature and gives excellent adhesion on a wide range of materials in a considerably short amount of time. Performs particularly well when low-curing temperatures are required for heat-sensitive components.
-
Excellent adhesion on wide range of materials
-
Fast acting
-
Perfect for heat-sensitive components
-
Heat-curable at low temperatures 80°C (176°F)
- Product category:
- Structural adhesives
Technologies:
-
Thermosets, electronics assembly materials
- Applications:
- Structural bonding
- Color:
- Black
- Cure type:
- Heat cure
- Key characteristics:
- Viscosity: medium viscosity
- Number of components:
- 1 part
- Storage temperature:
- -15.0 °C - -25.0 °C
