Underfills
One-part underfill compatible with small gap sizes
One-part, epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1 mm.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
If you’re looking for an underfill to increase the reliability of small-gap flip-chips, consider LOCTITE® ECCOBOND FP4531. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications via capillary action. LOCTITE® ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.
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Compatible with small gap sizes
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Snap-curable
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Fast flow
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Passes NASA outgassing
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Flexural modulus:
- 7600.0 N/mm² (1102000.0 psi)
