NVIDIA's groundbreaking work in scaling data centers and pioneering AI is transforming the world, and Henkel is poised to support this innovation by addressing thermal challenges and leveraging our strong OSAT connections to help you stay ahead in the accelerated computing and AI markets.
Innovation
Henkel’s advanced adhesives enable NVIDIA to rapidly develop and integrate cutting-edge GPUs and data center components, maintaining a lead in performance and innovation.
Customization
Leveraging Henkel's adhesive expertise, NVIDIA accelerates development with customized solutions, speeding up the launch of cutting-edge technologies and gaining a competitive edge.
Sustainability
Henkel’s sustainable adhesives and innovative materials help NVIDIA reduce energy use and carbon footprint, enhancing overall efficiency and sustainability.
Unlock the potential of your networking line card heat sinks with microTIM, the cutting-edge micro thermal interface coating. Engineered for durability and high thermal conductivity, microTIM is a thin film coating meticulously applied to line card heat sinks that interface with POMs. By seamlessly integrating with heat-generating devices, microTIMs optimize heat dissipation and elevate system efficiency.
Semiconductors are engineering marvels that drive NVIDIA's advanced AI leadership. Meeting AI's GPU and CPU performance needs, Henkel’s engineered materials keep chips cool efficiently in cost, energy, and carbon. Across industries, NVIDIA relies on these crucial materials for optimal performance and supply chain resilience.
Read the eBook tailored for NVIDIA to discover novel materials powering the next era of semiconductor technology.
- Routers/switches
- Optical transceiver
- Servers
- Advanced semiconductor packaging
microTIMs are ultra-thin durable thermal interface material coatings which are applied to networking line card riding heat sinks. microTIMs enhance the thermal performance between riding heatsinks and POMs and withstand up to 500 insertion and pulls.
High performance CPUs, GPUs, ASIC and FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing low thermal impedance and high pump out resistance.
We have both 1-part thermal gels and 2-part thermal gap fillers available. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 10.0 W/m-K. While our thermal gap fillers have a thermal conductivity of up to 4.5 W/m-K.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
Ultra low modulus Bergquist® GAP PAD® materials provide excellent conformability, low-stress and high thermal performance conductivity up to 12W/mK across a wide range of data center infrastructure products.
Underfills offer improved mechanical integrity and reliability for fine-pitch array components and certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
The use of advanced materials in server motherboards and line cards for routers and switches provides a huge upside in scale, performance, and cost reduction. One small uptick in performance, repeated thousands of times, has a huge impact on router and switch performance.
Underfills offer improved mechanical integrity and reliability for fine-pitch array components and certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
Ultra low modulus Bergquist® GAP PAD® materials provide excellent conformability, low-stress and high thermal performance conductivity up to 12W/mK across a wide range of data center infrastructure products.
A precise active optical alignment process enables accurate, cost-effective production of optical subassemblies such as TOSA, ROSA, BOSA. Henkel's dual-cure UV adhesives are designed to precisely align optical components and secure their long-term performance through stability-enhancing attributes such as low shrinkage, low CTE, good light transmittance, low moisture absorption and high reliability.
We have both 1-part thermal gels and 2-part thermal gap fillers available. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 10.0 W/m-K. While our thermal gap fillers have a thermal conductivity of up to 4.5 W/m-K.
LOCTITE® ABLESTIK® one-component, low-bleed, low-outgassing, high-performance, high-reliability conductive die attach adhesives and semi-sintering materials are ideal for laser diode bonding.
Electrically and thermally conductive flexible silicones are ideal for bonding and gasketing of EMI/RF-shielded enclosures.
LOCTITE one-component silicone gasketing and sealing products allow for load bearing and shock absorption at the bond location. The materials are designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework in optoelectronics applications.
Whether it’s a few servers in a closet or 10,000 in a data center, a small reduction in heat or uptick in component performance can have a huge, aggregate impact on infrastructure performance. Advanced materials can be used throughout a circuit board to help optimize their performance and the network that uses them.
Ultra low modulus Bergquist® GAP PAD® materials provide excellent conformability, low-stress and high thermal performance conductivity up to 12W/mK across a wide range of data center infrastructure products.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
We have both 1-part thermal gels and 2-part thermal gap fillers available. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 10.0 W/m-K. While our thermal gap fillers have a thermal conductivity of up to 4.5 W/m-K.
High performance CPUs, GPUs, ASIC and FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing low thermal impedance and high pump out resistance.
Whether it’s a few servers in a closet or 10,000 in a data center, a small reduction in heat or uptick in component performance can have a huge, aggregate impact on infrastructure performance. Advanced materials can be used throughout a circuit board to help optimize their performance and the network that uses them.
Wafer-level packaging applications have seen explosive growth as they continue to be key enablers of innovation in mobility products, consumer electronics, data processing, and IoT applications, among others.
The convergence of advanced RF communication capabilities, miniaturization, and package-level integration underscore the requirement for novel approaches to EMI shielding.
Higher I/O counts, package integration, and tighter bump pitches are dictating the use of flip-chip technology to enable advanced package designs.
Advanced flip-chip technology and heterogeneous integration are key enablers of high-performance computing, driving new levels of processing power for desktops, data center servers, autonomous driving systems, and more.
Advanced packaging techniques meet intensifying demands for applications like flip chip, wafer-level packaging, and memory 3D TSVs. With miniaturized form factor and processing power, advanced packaging enables system level integration, higher functionality, and faster performance.
- White papers
- Infographics
- Articles
- Brochures
There is no limit to what NVIDIA and Henkel can achieve together. Reach out and let's start a conversation!
