Underfills
One-part, void-free, second level epoxy underfill
Epoxy-based formulation for a uniform and void-free encapsulant underfill.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2420247
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE® ECCOBOND UF 1173. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE® ECCOBOND UF 1173 has a long pot life and exhibits low-CTE properties to improve the bond strength and stability.
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Void-free
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Low coefficient of thermal expansion (CTE)
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48-hour pot life at 25°C (77°F)
Product category:
Underfills
Technologies:
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Thermosets, electronics assembly materials
Color:
Black
Cure type:
Heat cure
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Large volume or special order?
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