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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Underfills

LOCTITE® ECCOBOND UF 1173

One-part, void-free, second level epoxy underfill

Epoxy-based formulation for a uniform and void-free encapsulant underfill.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2420247

LOCTITE® ECCOBOND UF 1173, 10 ml Syringe

Documents

Information

When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE® ECCOBOND UF 1173. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE® ECCOBOND UF 1173 has a long pot life and exhibits low-CTE properties to improve the bond strength and stability.

Product category:

Underfills

Technologies:

Color:

Black

Cure type:

Heat cure

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