Henkel Adhesive Technologies

Henkel Adhesive Technologies

Die attach adhesives


Electrically conductive adhesive designed for microelectronic chip bonding applications 

Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering. 


Die Attach

Cure schedule, @ 150.0 °C:

1.0 hr.

Cure type:

Heat Cure

Number of components:

1 Part

Physical form:


Shear strength, Aluminum:

1500.0 psi

Storage temperature:

-40.0 °C

Thixotropic index:


Viscosity, Brookfield CP51, @ 25.0 °C:

30000.0 mPa·s (cP)

Volume resistivity:

0.0005 Ohm cm

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