Henkel Adhesive Technologies

Henkel Adhesive Technologies

Die attach adhesives

LOCTITE® ABLESTIK 84-1LMI

Electrically conductive adhesive designed for microelectronic chip bonding applications 

Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering. 

Applications:

Die Attach

Cure schedule, @ 150.0 °C:

1.0 hr.

Cure type:

Heat Cure

Number of components:

1 Part

Physical form:

Paste

Shear strength, Aluminum:

1500.0 psi

Storage temperature:

-40.0 °C

Thixotropic index:

4.0

Viscosity, Brookfield CP51, @ 25.0 °C:

30000.0 mPa·s (cP)

Volume resistivity:

0.0005 Ohm cm

Please contact us for ordering options

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.