Part no. (SKU/IDH):
1200130
IDH Name:
LOCTITE® ABLESTIK 84-1LMI
Die attach adhesives
Electrically conductive adhesive for microelectronic chip bonding applications
A 1-part, die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
Part no. (SKU/IDH):
1200130
IDH Name:
LOCTITE® ABLESTIK 84-1LMI
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Question & answer
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
-
Electrically conductive
-
Low bleed
-
Low outgassing
- Product category:
- Electrically conductive adhesives
Technologies:
-
Electronics semiconductor materials
- Applications:
- Die attach
- Cure schedule, @ 150.0 °C:
- 1.0 h
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Physical form:
- Paste
- Shear strength, Aluminum:
- 1500.0 psi
- Storage temperature:
- -40.0 °C
- Thixotropic index:
- 4.0
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 30000.0 mPa·s (cP)
- Volume resistivity:
- 0.0005 Ohm cm
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
Every question, request, and challenge is an opportunity for us to help your business perform. And we have all the right people ready to make it happen.
Check our FAQ for quick answers or reach out via phone to our support center. Here, we also offer additional inquiry forms to help you connect with the appropriate Henkel expert.