Die attach adhesives
Electrically conductive adhesive for microelectronic chip bonding applications
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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Electrically conductive
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Low bleed
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Low outgassing
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Cure schedule, @ 150.0 °C:
- 1.0 hr.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Physical form:
- Paste
- Shear strength, Aluminum:
- 1500.0 psi
- Storage temperature:
- -40.0 °C
- Thixotropic index:
- 4.0
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 30000.0 mPa·s (cP)
- Volume resistivity:
- 0.0005 Ohm cm
