Henkel Adhesive Technologies

Henkel Adhesive Technologies

Underfills

LOCTITE® ECCOBOND E 1216M

One-part, capillary-flow epoxy underfill for high volume operations

Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.

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Documents

Information

If you’re looking for an underfill that can handle high-volume assembly operations where fast-flow filling is required, LOCTITE® ECCOBOND E 1216M is a great pick. Our ECCOBOND E 1216M composite cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 20oz). This black, epoxy-based underfill is ideal for those who prefer to work with anhydride-free products, as it’s specifically formulated to eliminate anhydride-type curing agents.

Coefficient of thermal expansion (CTE), Above Tg:

131.0 ppm/°C

Coefficient of thermal expansion (CTE), Below Tg:

35.0 ppm/°C

Glass transition temperature (Tg):

125.0 °C

Viscosity, Brookfield, Spindle 4, speed 20 rpm:

4000.0 mPa·s (cP)

Work life:

5.0 day

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