Underfills
One-part, capillary-flow epoxy underfill for high volume operations
Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
1636425
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
If you’re looking for an underfill that can handle high-volume assembly operations where fast-flow filling is required, LOCTITE® ECCOBOND E 1216M is a great pick. Our ECCOBOND E 1216M composite cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 20oz). This black, epoxy-based underfill is ideal for those who prefer to work with anhydride-free products, as it’s specifically formulated to eliminate anhydride-type curing agents.
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Void-free
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Retains stability during shipping, storage, and use
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Snap-curing
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High glass transition temperature (Tg)
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 131.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 35.0 ppm/°C
- Glass transition temperature (Tg):
- 125.0 °C
- Viscosity, Brookfield, Spindle 4, speed 20 rpm:
- 4000.0 mPa·s (cP)
- Work life:
- 5.0 day
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
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