Underfills
One-part, capillary-flow epoxy underfill for high volume operations
Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
1636425
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
If you’re looking for an underfill that can handle high-volume assembly operations where fast-flow filling is required, LOCTITE® ECCOBOND E 1216M is a great pick. Our ECCOBOND E 1216M composite cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 20oz). This black, epoxy-based underfill is ideal for those who prefer to work with anhydride-free products, as it’s specifically formulated to eliminate anhydride-type curing agents.
-
Void-free
-
Retains stability during shipping, storage, and use
-
Snap-curing
-
High glass transition temperature (Tg)
- Product category:
- Underfills
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 131.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 35.0 ppm/°C
- Glass transition temperature (Tg):
- 125.0 °C
- Viscosity, Brookfield, Spindle 4, speed 20 rpm:
- 4000.0 mPa·s (cP)
- Work life:
- 5.0 day
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
