Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically conductive adhesives


High strength, electrically conductive adhesive for a controlled bondline

This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options



For continuous high resistance to delamination and popcorning, choose LOCTITE® ABLESTIK QMI529HT-2A1. This high strength, hybrid technology, electrically conductive die attach adhesive is hydrophobic, and ideal for high accuracy applications with consistent bondline thickness for superior functionality.

This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.


Die attach

Coefficient of thermal expansion (CTE):

53.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

156.0 ppm/°C

Cure type:

Heat cure

Glass transition temperature (Tg):

3.0 °C

Thermal conductivity:

6.0 W/mK

Thixotropic index:



185000.0 mPa·s (cP)

Please contact us for ordering options

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.